Dr. Duane S. Boning is the Clarence J. LeBel Professor in Electrical Engineering, and Professor of Electrical Engineering and Computer Science (EECS) at MIT. Dr. Boning is affiliated with the MIT Microsystems Technology Laboratories and served as MTL Associate Director for Computation and CAD through August 2024. He was also the Engineering Faculty Co-Director of the MIT Leaders for Global Operations (LGO) program, from September 2016 through December 2024. Dr. Boning served as Associate Head of the EECS Department at MIT from 2004 to 2011, the Director/Faculty Lead of the MIT Skoltech Initiative from 2011 to 2013, and the faculty Director of the MIT/Masdar Institute Cooperative Program from 2011 to July 2018.
Dr. Boning received SB degrees in electrical engineering and computer science in 1984, and SM and PhD degrees in electrical engineering in 1986 and 1991, respectively, all from MIT. Dr. Boning was a National Science Foundation Fellow from 1984 to 1989 and an Intel Graduate Fellow in 1990, and from 1991 to 1993 was a Member of Technical Staff at the Texas Instruments Semiconductor Process and Design Center in Dallas, Texas, working on semiconductor process representation, process/device simulation tool integration, and statistical modeling and optimization.
Dr. Boning is a Fellow of the Institute of Electrical and Electronics Engineers (IEEE), and has served as Editor in Chief for the IEEE Transactions on Semiconductor Manufacturing, and as chairman of the CFI/Technology CAD Framework Semiconductor Process Representation Working Group. He is also a member of Electrochemical Society, Eta Kappa Nu, Tau Beta Pi, Materials Research Society, Sigma Xi, and the Association of Computing Machinery.
Research Interests
His research interests include the modeling and control of variation in IC, photonics, and MEMS processes, devices, and circuits. Particular emphasis is on statistical characterization and design for manufacturing of devices and circuits in advanced technologies, and the modeling of chemical mechanical polishing (CMP), spin-on coatings, plasma etch, and nanoimprint/embossing processes.
Teaching
- Spring 2023 and Spring 2024: 6.101 Fundamentals of Programming
- Spring 2019 to Fall 2020, Fall 2022, Fall 2023: 6.036 Introduction to Machine Learning
- Spring 2005- Fall 2023: 6.780J/2.830J Manufacturing Process Control (co-lecture with D. Hardt)
- Spring 2017 to Fall 2018: 6.009 Fundamentals of Programming
- Fall 2016/Spring 2016/Fall 2015/Spring 2014: 6.01 Intro to EECS I
- Fall 2005-2013: Lectures (part) in 2.853/2.854 Introduction to Manufacturing Systems
- Fall 2005-2008: Lectures (part) in 2.810 Manufacturing Processes and Systems
- Spring 2004: 6.001 Structure and Interpretation of Computer Programs
- Spring 2003: 6.780 Semiconductor Manufacturing
- Fall 2002: 6.003 Signals and Systems
- Fall 2001: 6.001 Structure and Interpretation of Computer Programs
- Spring 2000: 6.011 Intro to Communications, Control, and Signal Processing
Research Projects
- Statistical Metrology: modeling of CMP, variation in processes/devices/circuits
- SEMATECH/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing, with emphasis on waste reduction in CMP.
- Semiconductor Process Control – Run by Run Control, Sensor Technology, and Data Analysis
Additional Service
- Editor in Chief of the IEEE Transactions on Semiconductor Manufacturing (2001-2011)
- Moderator of the Labnetwork mailing list