Zhengqi Gao  | Zhengqi Gao joined the group in September 2021 and is received his Ph.D. degree in EECS at MIT in 2026. He received his B.E. and M.S. in microelectronics engineering from Fudan University in 2018 and 2021, respectively. His current research interests lie mainly in design automation for photonic integrated circuits, novel computing paradigm, and applied machine learning. (https://zhengqigao.github.io) |
Chih-Yu (Andrew) Lai | Andrew joined the group in January 2022 and received his Ph.D. degree in EECS at MIT. He received his B.S. (2017) and M.S. (2019) degrees in biomechatronics engineering from National Taiwan University. He worked in TSMC as a standard cell layout engineer prior to attending MIT. His interests include machine learning and quantitative modeling on time series, computer vision, semiconductor manufacturing, design automation, and bioelectronics. (https://chihyulai.com) |
Rachel Owens | Rachel joined the group in September 2022 and is pursuing the S.M. and Ph.D. degrees in EECS at MIT. She received her B.S. (2020) in EE from University of the Pacific before working as an electrical engineer at Raytheon Technologies. Her current research interests are primarily in the area of machine learning for semiconductor manufacturing. |
Jiahe Shi | Jiahe joined the group in August 2024. |
Fan-Keng Sun | Fan-Keng joined the group in September 2019 and received his the S.M. and Ph.D. degrees in EECS at MIT. He received his B.S. majoring in EE and minoring in CS from National Taiwan University in 2019. His interests include machine learning and deep learning for time series and sequence modeling. |
Yu-Cheng Wu | Yu-Cheng Wu joined the group in September 2024 and is now pursuing Ph.D. degrees in EECS at MIT. He received his B.S. in electrical engineering from National Taiwan University in 2019, where he worked on topics at the intersection of machine learning and electronic design automation and his S.M. at MIT in 2026. His current research mainly focuses on deep learning for general time series modeling and time series analysis for manufacturing applications. |